Panasonic Network Card 2SA2163 User Manual

This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors  
2SA2163  
Silicon PNP epitaxial planar type  
For high frequency amplification  
Unit: mm  
Features  
High transition frequency fT  
3
2
1
Optimum for high-density mounting and downsizing of the equipment for  
Ultraminiature leadless package  
0.6 mm
×
1.0 mm (height 0.39 mm)  
+0.01  
0.39  
1.00±0.05  
0.03  
Absolute Maximum Ratings T
a
= 25
°
C  
0.25±0.05  
0.25±0.051  
Parameter  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Rating  
30  
Unit  
V
2
3
V
20  
0.65±0.01  
0.05±0.03  
V
5  
mA  
mW  
°
C  
°
C  
30  
1: Base  
2: Emitter  
Collector power dissipation  
Junction temperature  
PC  
100  
3: Collector  
ML3-N2 Package  
Tj  
125  
Marking Symbol: 6J  
Storage temperature  
T
stg  
55 to +125  
Electrical Characteristics T
a
= 25
°
C±3
°
C  
Parameter  
Base-emitter voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
V
VBE  
ICBO  
ICEO  
IEBO  
hFE  
V
CE
10 V, IC
1 mA  
VCB
10 V, I
E
= 0  
0.7  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
0.1  
100  
10  
µA  
µA  
µA  
V
CE
20 V, IB = 0  
VEB
5 V, IC = 0  
V
CE
10 V, IC −1 mA  
70  
220  
Collector-emitter saturation voltage  
Transition frequency  
VCE(sat) IC
10 mA, IB
1 mA  
V
0.1  
300  
2.8  
fT  
VCB
10 V, IE = 1 mA, f = 200 MHz  
150  
MHz  
dB  
Noise figure  
NF  
Zrb  
Cre  
VCB
10 V, IE = 1 mA, f = 5 MHz  
VCB
10 V, IE = 1 mA, f = 2 MHz  
VCB
10 V, IE = 1 mA, f = 10.7 MHz  
4.0  
50  
Reverse transfer impedance  
22  
Reversetransfercapacitance(Commonemitter)  
1.2  
2.0  
pF  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
Publication date: May 2005  
SJC00336AED  
1
 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
 

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